Теплопроводящие интерфейсные материалы

Подкатегории

W10TR600A-0.5
Thermal Insulator, Filler Pad, 6 W/m.K, 0.5 mm, 0.167 °C/W

AMEC THERMASOL

  • Filler Pad
  • 6 W/m.K
  • 0.5 mm
  • 0.167 °C/W
A17747-03
Heat Sink Pad, Gap Filler, Polyimide Lined Elastomer, 228.6 mm x 228.6 mm x 0.762 mm, 3 W/m.K

LAIRD

  • Gap Filler
  • Polyimide Lined Elastomer
  • 228.6 mm x 228.6 mm x 0.762 mm
  • 3 W/m.K
MP008826
Heat Sink Pad, Silicone, 150 mm x 150 mm x 1.5 mm, 10 W/m.K

MULTICOMP PRO

  • Silicone
  • 150 mm x 150 mm x 1.5 mm
  • 10 W/m.K
HTC700G
Heat Transfer Paste, Non-Silicone, Thermally Conductive, Cartridge, 700 g

ELECTROLUBE

  • Non-Silicone
  • Thermally Conductive
  • Cartridge
  • 700 g
40006020
Thermally Conductive Material, 6 W/m.K, 400 mm L x 200 mm W x 2 mm T

WURTH ELEKTRONIK

  • 6 W/m.K
  • 400 mm L x 200 mm W x 2 mm T
A18440-07
Thermal Joint Compound, Cartridge, 300cc, CoolZorb Series

LAIRD

  • Cartridge
  • 300cc
  • CoolZorb Series
A17752-06
THERMAL GAP FILLER, 228.6X228.6X1.524MM

LAIRD

  • 228.6X228.6X1.524MM
GEL F 80 45 - 200 X 400 MM
Thermally Conductive Foil, 8 W/m.K, 400 mm x 200 mm x 4.5 mm

FISCHER ELEKTRONIK

  • 8 W/m.K
  • 400 mm x 200 mm x 4.5 mm
A15340-01
Thermal Pad, Tflex 300 Series, 1.2 W/m.K, Silicone Elastomer, 5 mm, 229 mm

LAIRD

  • Tflex 300 Series
  • 1.2 W/m.K
  • Silicone Elastomer
  • 5 mm
  • 229 mm
A16367-44
Thermal Pad, Tflex HR600 Series, 3 W/m.K, Boron Nitride Filled, 1 mm, 229 mm

LAIRD

  • Tflex HR600 Series
  • 3 W/m.K
  • Boron Nitride Filled
  • 1 mm
  • 229 mm
TC-5026 1KG
Thermal Conductive Compound, DOWSIL TC-5026, Grey, 1kg

DOW

  • DOWSIL TC-5026
  • Grey
  • 1kg
A17752-16
Thermal Gap Filler, Ceramic Filled Silicone Sheet, 7.5 W/m.K, 228.6 mm x 228.6 mm x 4.064 mm

LAIRD

  • Ceramic Filled Silicone Sheet
  • 7.5 W/m.K
  • 228.6 mm x 228.6 mm x 4.064 mm
MP008849
Heat Sink Pad, Silicone, 150 mm x 100 mm x 2 mm, 30 W/m.K

MULTICOMP PRO

  • Silicone
  • 150 mm x 100 mm x 2 mm
  • 30 W/m.K
A13418-01
Thermal Phase Change Material, 229 mm x 229 mm x 0.13 mm

LAIRD

  • 229 mm x 229 mm x 0.13 mm
MP-TG-A2200-130-3.0
Thermal Pad, 3000000Mohm-m, 2.2m.K, Silicone, 130mm x 130mm x 3mm

MULTICOMP PRO

  • 3000000Mohm-m
  • 2.2m.K
  • Silicone
  • 130mm x 130mm x 3mm
A17752-08
THERMAL GAP FILLER, 228.6X228.6X2.032MM

LAIRD

  • 228.6X228.6X2.032MM
GPVOUS-0.080-00-0816
Thermal Gap Pad, VO Ultra Soft, 0.080", 8" x 16"

BERGQUIST

  • VO Ultra Soft
  • 0.080"
  • 8" x 16"
A12624-01
THERMAL GAP FILLER, 228.6X228.6X2.54MM

LAIRD

  • 228.6X228.6X2.54MM
MPGCS-DGP20-2P
2-Part Dispensible Thermal Gap Filler, Yello/White, 1.8W/mK, 200ml

MULTICOMP PRO

  • Yello/White
  • 1.8W/mK
  • 200ml
EYGS1818ZLX2
Thermal Interface Material, GraphiteTIM, 400 W/m.K, Graphite Sheet, 200 µm, 180 mm

PANASONIC

  • GraphiteTIM
  • 400 W/m.K
  • Graphite Sheet
  • 200 µm
  • 180 mm
MP-TG-A6200-150-2.0
THERMAL PAD, 150MM X 150MM X 2MM, BLUE

MULTICOMP PRO

  • 150MM X 150MM X 2MM
  • BLUE
EYGR1818ZRX2
Thermally Conductive Material, Graphite Sheet, 200W/m.K, 180 mm L x 180 mm W x 0.35 mm T

PANASONIC

  • Graphite Sheet
  • 200W/m.K
  • 180 mm L x 180 mm W x 0.35 mm T
A16104-16
Thermal Pad, Tflex HR600 Series, 3 W/m.K, Silicone Elastomer, 4 mm, 229 mm

LAIRD

  • Tflex HR600 Series
  • 3 W/m.K
  • Silicone Elastomer
  • 4 mm
  • 229 mm
BOND PLY TBP 850
Thermal Insulator, Bond-Ply 100 .008", 12" x 12" Sheet, 0.8 W/m.K, 6 kV, 0.203 mm

BERGQUIST

  • Bond-Ply 100 .008"
  • 12" x 12" Sheet
  • 0.8 W/m.K
  • 6 kV
  • 0.203 mm
WLPK 3
Thermal Compound, Silicone Free, Ceramic Filled, Syringe, 3ml

FISCHER ELEKTRONIK

  • Silicone Free
  • Ceramic Filled
  • Syringe
  • 3ml